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FCCSP Substrate Manufacturer

FCCSP Substrate Manufacturer FCCSP Substrate Manufacturer,Flip Chip Chip Scale Package (FCCSP) substrates are advanced packaging solutions that provide a compact and efficient method for integrating semiconductor chips into electronic devices. FCCSP substrates are designed to support flip chip technology, where the chip is flipped and bonded directly onto the substrate using solder bumps. This packaging method offers excellent electrical performance, enhanced heat…

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