25+
More than 20 years Manufacturing Experience
130+
Serving customers in more than 130 countries
200000m2
We have an oversized factory and equipment workshop
100%
100% product service and quality satisfaction
Name Ihrer Website
- Telefon: +086 0755 85241496
- E-Mail: bgasubstrates@qycltd.com
WHY CHOOSE SHENZHEN QYC CO.,LTD?
In the ever-evolving field of electronic manufacturing, precision and reliability are non-negotiable. Shenzhen QYC Co., Ltd. is a professional PCB manufacturer.
We boast over 10,000 dedicated employees and cutting-edge equipment specially sourced from Japan. We take pride in consistently delivering high-quality FC BGA boards. Quality assurance is the cornerstone of our operation. The high-precision equipment meticulously sourced from Japan is the backbone of our commitment to providing top-notch FC BGA boards. As a result, our customers can trust the level of quality and stability completely.
Our production capability covers a wide range of designs, from 4-layer to 20-layer flip-chip packaging substrates. Whether your project demands compact designs or multi-layer solutions, our expertise and infrastructure will be customized to your needs. What sets us apart is our ability to work with outstanding precision, with a minimum line width of 9 micrometers and a minimum spacing of 9 micrometers.
Our turnaround time is exceptionally short, in der Regel von 1 An 2 months. Despite our swift production pace, quality always remains our top priority. We firmly believe that even under tight deadlines, quality cannot be compromised. Each project undergoes rigorous quality control and testing procedures to ensure that every packaged substrate produced exhibits outstanding performance and reliability. This rapid delivery, coupled with our unwavering commitment to maintaining the highest quality standards, ensures that your projects run smoothly and seamlessly.
Material selection is crucial in the manufacturing process of packaging substrates. We offer a variety of packaging material options, with most sourced from Asia, including Japan, Korea, Taiwan, and China. We deeply understand that each project is unique, so we flexibly select and utilize the most suitable materials according to our clients' needs, ensuring that the produced packaging substrates perfectly meet the specific requirements of the project.
Our goal is to provide excellent solutions, driving the continuous advancement of the electronics industry and creating greater value for our customers. We look forward to collaborating with you to achieve project success.
ABOUT USMore
We are a QYC PCB manufacturer. When you view our product section, we present our offerings in article form without including extensive production data. The primary reason for this is to facilitate Google network promotion. If you have any design or production inquiries regarding packaging substrates and HDI PCBs, feel free to contact us, and our engineers will respond promptly. Zusätzlich, we primarily produce the following types of packaging substrates: Multilayer PCB, HDI PCB, Hohlraum-Leiterplatte, Rigid-Flex PCB, Isola Leiterplatte, Teflon PCB, Taconic PCB, Keramische Leiterplatte, Hochfrequenz-Leiterplatte, Hochgeschwindigkeits-Leiterplatte, Substrat für Verpackungen, Spezielle Leiterplatte, etc.
Furthermore, we have a comprehensive range of advanced packaging production lines and provide advanced packaging services.
During the process of designing packaging substrates, if you have doubts about the production process capabilities or are unsure whether the factory can produce the ideal packaging substrate according to your design requirements, please do not hesitate to send us an email. We are always willing to listen to your concerns and needs. We have a strong team of over 200 engineers dedicated to solving your technical and design issues.
Every month, we welcome nearly 100 An 200 new customers from around the world. Some of these customers find us through the Internet, while others are referred by existing customers. This extensive international collaboration experience enables us to handle a wide range of different needs and challenges. Our quality is stable and reliable because our equipment is always maintained at an advanced level, and the materials we use are high-quality brands specified by our customers.
In our collaboration, our goal is to ensure that each customer receives the highest level of service and products. We firmly believe that through active collaboration, we can jointly drive project success and achieve excellence in packaging substrate design and manufacturing.
No matter how complex your challenges are, we are willing to work with you to create outstanding solutions that bring your projects to life. We look forward to establishing a close working relationship with you and providing you with professional support and advice.
What sets us apart from the competition? Our ability to listen to our customers!
Our goal of achieving 100% customer satisfaction has transformed us from a single-product company into a progressive company with a variety of world-class, high-quality FC-BGA (Flip Chip Ball Grid Array) boards used in servers, artificial intelligence, networking, communications, military, industrial, Luft- und Raumfahrt, and other industries. Our technology and products span multiple critical areas, supporting various industries in meeting the demands of modern electronic devices for high density, high performance, and high reliability.
Every month, we welcome approximately 100 An 200 new customers from around the world. Some discover us through online channels, while others are referred by existing customers. Our customer base extends to several countries